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| Art Unit: | 2899 — Active solid-state devices (e.g., transistors, solid-state diodes) |
|---|---|
| Group: | 28XX — Semiconductors B |
| Classes: |
257 — Active solid-state devices (e.g., transistors, solid-state diodes) 438 — Semiconductor device manufacturing: process 174 — Electricity: conductors and insulators 277 — Seal for a joint or juncture 219 — Electric heating 156 — Adhesive bonding and miscellaneous chemical manufacture 378 — X-ray or gamma ray systems or devices |
| Phone: | (571) 270-7394 |
| Email: | wilner.jeanbaptiste@uspto.gov |
| Location: | VA 22314 |
| Title: | Pat Examnr Elctrl Engrg |
| Service: | 18 years |
| Grade: | GS-13 |
| 3-Year Grant rate: | 93% over 435 cases |
|---|---|
| Difficulty: | Extremely Easy |
| Difficulty Percentile: | 10th
|
With Examiner Jean, you have a 93% chance of getting an issued patent by 3 years after the first office action. Examiner Jean is an extremely easy examiner and in the 10th percentile across all examiners (with 100th percentile most difficult).
Below is the grant rate timeline for Examiner Jean, where the timeline is relative to the date of the first office action. The three-year grant rate is the percentage of applications granted at three years after the first office action.
Examiner Jean's grant rate is higher than that of Art Unit 2899 and higher than that of the USPTO.
| Average Office Actions Per Grant | |
|---|---|
| Examiner Jean | 1.2 |
| Art Unit 2899 | 1.2 |
Examiner Jean has granted 340 of 361 cases without any applicant-requested interviews for a grant rate of 94%.
Examiner Jean has granted 64 of 74 cases with at least one applicant-requested interview for a grant rate of 86%.
With Examiner Jean, conducting an interview decreases your chance of getting a patent granted by 9%.
| Number | Title | OA Rejections | Status | IFW |
|---|---|---|---|---|
| 17699028 | Microelectronic Structure Including Active Base Substrate With Through Vias Between A Top Die And A Bottom Die Supported On An Interposer | Rejection information available with a Premium Stats subscription. See our pricing. | Patented | View |
| 18225286 | Grain Structure Engineering For Metal Gapfill Materials | Patented | View | |
| 18190206 | Compensation Method For Wafer Bonding | Patented | View | |
| 17946883 | Stacked Semiconductor Method And Apparatus | Patented | View | |
| 17728625 | Methods And Apparatus For Integrating Carbon Nanofiber Into Semiconductor Devices Using W2w Fusion Bonding | Patented | View | |
| 18402755 | Apparatus Including Integrated Segments And Methods Of Manufacturing The Same | Patented | View | |
| 17970964 | Manufacturing Method Of Diamond Composite Wafer | Patented | View | |
| 18140960 | Semiconductor Package And Method Of Manufacturing Same | Patented | View | |
| 18249351 | Method And Device For Producing A Semiconductor Component | Patented | View | |
| 17891601 | Semiconductor Manufacturing Device And Method Of Manufacturing Semiconductor Device | Patented | View | |
| 18076210 | Via Formed Using A Partial Plug That Stops Before A Substrate | Patented | View | |
| 18151663 | Adding Sealing Material To Wafer Edge For Wafer Bonding | Patented | View | |
| 17980571 | Semiconductor Package And Fabrication Method Thereof | Patented | View | |
| 18108984 | Module With Gas Flow-Inhibiting Sealing At Module Interface To Mounting Base | Patented | View | |
| 18188621 | Die Bonding Tool With Tiltable Bond Head For Improved Bonding And Methods For Performing The Same | Patented | View | |
| 17895047 | Semiconductor Structure And Method Of Forming The Same | Patented | View | |
| 17889914 | Perpendicular Semiconductor Device Assemblies And Associated Methods | Patented | View | |
| 18123967 | Method For Manufacturing Semiconductor Package Structure | Patented | View | |
| 17820306 | Semiconductor Device And Method Of Manufacturing Semiconductor Device | Patented | View | |
| 17891949 | Package Structures And Methods Of Manufacturing The Same | Patented | View | |
| 18738707 | Methods Of Reducing Parasitic Capacitance In Semicondutor Devices | Patented | View | |
| 18593775 | Hybrid Backside Thermal Structures For Enhanced Ic Packages | Patented | View | |
| 18485291 | Semiconductor Device | Patented | View | |
| 17934346 | Thermally Enhanced Chip-On-Wafer Or Wafer-On-Wafer Bonding | Patented | View | |
| 18544747 | Integrated Circuit Chip Including A Passivation Nitride Layer In Contact With A High Voltage Bonding Pad And Method Of Making | Patented | View | |
| 17876518 | Integrated Antennas On Side Wall Of 3d Stacked Die | Patented | View | |
| 17962131 | Semiconductor Die Having An Optical Detection Marker And Method Of Producing The Semiconductor Die | Patented | View | |
| 18772247 | Package Structures | Patented | View | |
| 17952925 | Semiconductor Package Having Improved Heat Dissipation Characteristics | Patented | View | |
| 17743999 | Semiconductor Package And Method Of Forming Same | Patented | View | |
| 17857967 | Systems And Methods For Direct Bonding In Semiconductor Die Manufacturing | Patented | View | |
| 17896638 | Semiconductor Package, And Method Of Manufacturing The Same | Patented | View | |
| 18076364 | Integrated Mechanical Aids For High Accuracy Alignable-Electrical Contacts | Patented | View | |
| 17931796 | Manufacturing Method Of Semiconductor Chip | Patented | View | |
| 17890734 | Conductive Adhesive Assembly For Semiconductor Die Attachment | Patented | View | |
| 18520996 | Source/drain Metal Contact And Formation Thereof | Patented | View | |
| 18509801 | Seal Ring Designs Supporting Efficient Die To Die Routing | Patented | View | |
| 17885952 | Light-Emitting Device And Lighting Apparatus | Patented | View | |
| 18615151 | Semiconductor Device And Method Of Manufacturing The Same, And Electronic Apparatus | Patented | View | |
| 18771052 | Semiconductor Device And Method Of Manufacturing The Same, And Electronic Apparatus | Patented | View | |
| 18643474 | Interposer, Method For Fabricating The Same, And Semiconductor Package Having The Same | Patented | View | |
| 18106883 | Bonding And Transferring Method For Die Package Structures | Patented | View | |
| 17811654 | Semiconductor Memory Device And Method Of Manufacturing The Same | Patented | View | |
| 17651312 | Semiconductor Device | Patented | View | |
| 18508807 | Semiconductor Package | Patented | View | |
| 17888529 | Semiconductor Package Including Reinforcement Structure And Methods Of Forming The Same | Patented | View | |
| 18668941 | Solid-State Imaging Device And Electronic Apparatus | Patented | View | |
| 18447467 | Circuit Devices With Gate Seals | Patented | View | |
| 17885291 | Testing Memory Of Wafer-On-Wafer Bonded Memory And Logic | Patented | View | |
| 17836142 | Semiconductor Packages | Patented | View |
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